Microelectronics
As the scale of microelectronic components decreases, the defect size also decreases leading to new defect types whose impact on the device may not yet be known.
We investigate on both macro and nano levels to confront challenges emerging with new technology.
Keith E. Wagner Industry Contact
It takes expertise in materials and failure analysis on both the macro- and nano-levels to unravel these convoluted effects that emerge as technology and fabrication changes develop. RJ Lee Group experts apply techniques to detect these defects and investigate failures to resolve issues at the board and device levels.
Blazing the Trail
Microelectronic failures can be caused by many factors including process-related defects at any stage of the chip and component fabrication process. Our holistic approach to materials and failure problems, goes beyond the analytical data by interpreting the results and assisting our clients’ to apply those results to their process. We employ an interactive process to "blaze the trail" in determining the resolution clients require.
Some chips manufactured today use new materials and consist of more than eleven metal levels requiring over 300 sequenced processing steps. It is often in those numerous interfaces in a package that defects and failure occur. Our experts can evaluate raw materials, uncover process-produced defects, perform quality checks and evaluate the finished or returned product while ensuring complete client confidentiality.
- We analyze wafer substrates for residual contaminant films, point defects, and crystallographic features including orientation and inherent stress.
- We investigate compositional and physical characteristics of deposited and grown thin film layers and structures.
- We analyze solder materials for lead content and evaluate solder connections for defects and quality.
- We evaluate metallization contacts, traces and interconnects for process and service related defects and failures.
- We perform destructive physical analysis on IC packages to characterize chip failures.
- We investigate outgassing issues that result in odors and precipitated film residues on packaging and products.
- We analyze raw materials for ROHS compliance to determine concentrations of restricted substances.
It's in the Air
Air monitoring is used extensively in the chip and component production process to reduce particle contamination caused by both the process and the equipment. Our Environmental Health and Safety (EH&S) experts can design and carry out monitoring and sampling plans to characterize particulate, isolate the source of contaminants, determine how it affects the product and suggest corrective action. We are also able to develop and implement plans to monitor clean room facilities to ensure safety and compliance. Our EH&S team can investigate and monitor the effects of chemicals used in the production process for volatile organic compounds (VOCs) and other vapors generated during metallization.
