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A failed solder joint on a ceramic package was inspected and analyzed. The purpose of RJ Lee Group's (RJLG) analysis was to determine the composition of the separated surfaces to determine the cause of the separation. The samples were analyzed by scanning electron microscopy coupled with energy dispersive spectrometry (SEM/EDS). The plane of separation of the solder joint appeared to be associated with a nickel layer in the metallization system. Diffusion and mixing of the gold, tin and nickel components also appears to have occurred along the plane of separation.
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