RJ LeeGroup - Qualifications - Projects - Defect Analysis of De-capsulation of DIP Package

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Defect Analysis of De-capsulation of DIP Package
A dual inline-pin (DIP) package was subjected to and failed its producer's de-capsulation inspection. There was no indication to identify a prospective location or pin of failure and an exemplar device was not available. RJ Lee Group's (RJLG) inspection surveyed and identified evidence of electro-static surge damage to the internal device circuitry. The inspection of the pin circuitry was performed by an SEM equipped with a variable pressure chamber. Definitive evidence of electrical burnout was not observed during the survey inspection. The absence of significant damage suggests that any failure was characteristic of a low power event such as an electro-static type overload.