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With expertise across multiple disciplines, RJLG has the resources to develop innovative methodologies for implementing specialized research studies and for solving unique problems. Our experienced staff is capable of developing a solution to meet your unique materials characterization requirements.

Failure Analysis of Electronic Device Packaging
A market leader of medical devices and services was experiencing shorting failures in one of their electronic devices. RJ Lee Group (RJLG) tested electrical measurement (i.e., pin isolation, resistance). Decapsulation examination and characterization of materials and features associated with the failures were performed. Testing confirmed that the failures were caused by packaging. The analysis determined that dendritic growths occurred between contact metal due to electro migration.