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Thirteen modules were received for inspection and evaluation of solder joint connections associated with control input connectors on the modules. The modules consisted of plastic semi-hermetic packages housing hybrid circuitry on ceramic substrates. The joints were inspected by SEM techniques. Anomalies were observed in most of the examined solder connections including cracking, void formation, gas bubbles and alignment shifts between the contacts in the solder material. Evidence of physical shifting during the soldering process was also observed. It appeared to have occurred while the solder was in plastic state. Features can be improved upon by attention to industrial hygiene, control over process parameters and physical stabilizing the placement of the connectors during the entire soldering process.
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