Annealing Study of Grain Boundary Engineered Copper Using High Energy X-Ray Diffraction Microscopy

Publication Information:

Li, S.F., R.M. Suter, C.M. Hefferan, J. Lind, U.Lienert, J. Bernier, M. Kumar and B. Reed, Annealing Study of Grain Boundary Engineered Copper Using High Energy X-Ray Diffraction Microscopy, Presented at TMS 2012, 2012, Orlando, FL.

Year: 2012