Three-dimensional Plastic Response in Polycrystalline Copper Via Near-Field High Energy X-Ray Diffraction Microscopy

Publication Information:

Li, S.F, J.Lind, C.M. Hefferan, R. Pokharel, U. Lienert, A.D. Rollett and R.M. Suter, “Three-dimensional plastic response in polycrystalline copper via near-field high energy X-ray diffraction microscopy”, J. App. Crys., Vol. 45, pp. 1098-1108, 2012. DOI: 10.1107/S0021889812039519

Year: 2012

The evolution of the crystallographic orientation field in a polycrystalline sample of copper is mapped in three dimensions as tensile strain is applied. Using forward‐modeling analysis of high‐energy X‐ray diffraction microscopy data collected at the Advanced Photon Source, the ability to track intragranular orientation variations is demonstrated on an ∼2 µm length scale with ∼0.1° orientation precision. Lattice rotations within grains are tracked between states with ∼1° precision. Detailed analysis is presented for a sample cross section before and after ∼6% strain. The voxel‐based (0.625 µm triangular mesh) reconstructed structure is used to calculate kernel‐averaged misorientation maps, which exhibit complex patterns. Simulated scattering from the reconstructed orientation field is shown to reproduce complex scattering patterns generated by the defected microstructure. Spatial variation of a goodness‐of‐fit or confidence metric associated with the optimized orientation field indicates regions of relatively high or low orientational disorder. An alignment procedure is used to match sample cross sections in the different strain states. The data and analysis methods point toward the ability to perform detailed comparisons between polycrystal plasticity computational model predictions and experimental observations of macroscopic volumes of material.


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